Market Overview

Toshiba Memory Develops 96-Layer BiCS FLASH with QLC Technology


Boosts Single-Chip Memory Capacity to Highest Level yet Achieved

Memory America, Inc.
(TMA), the U.S.-based subsidiary of Toshiba
Memory Corporation, today announced the development of a prototype
sample of 96-layer BiCS FLASHTM, its proprietary
three-dimensional (3D) flash memory, with 4-bit-per-cell (quad level
cell, QLC) technology. With this milestone achievement, Toshiba
demonstrates its technology leadership in the storage market by
delivering technology that boosts single-chip memory capacity to the
highest level yet achieved1.

This press release features multimedia. View the full release here:

Toshiba Memory's 96-layer BiCS FLASH 3D flash memory boosts single-chip memory capacity to the highe ...

Toshiba Memory's 96-layer BiCS FLASH 3D flash memory boosts single-chip memory capacity to the highest level yet achieved. (Graphic: Business Wire)

Toshiba's new QLC BiCS FLASH significantly expands capacity by pushing
the bit count for data per memory cell from three to four. The new
product achieves the industry's maximum capacity of 1.33
terabits2 for a single chip, and a 16-die stacked
architecture in a single package realizes an unparalleled capacity of
2.66 terabytes.

The number of applications needing huge amounts of storage continues to
grow, fed by the enormous volumes of data being generated that need to
be accessed and analyzed in real time. Social media, SSDs, edge
computing, enterprise applications and the rapidly expanding data center
storage market are all areas in which larger capacity storage is
required – to name just a few. With the introduction of 96-layer QLC
technology, Toshiba Memory enables the development of products that keep
pace with the fast-moving storage market.

QLC technology has long been a part of Toshiba's roadmap strategy for
high-density, smaller chip size flash memory solutions: the company was
the first to publicly discuss QLC technology (at the 2016 Flash Memory
Summit) and one of the first to develop a 3D
flash memory device that uses it

"We were among the first in the industry to envision and prepare for the
successful migration of SLC technology to MLC, from MLC to TLC, and now
from TLC to QLC," noted Scott Nelson, senior vice president of TMA's
Memory Business Unit. "This technology evolution has made increasingly
dense packaging options available, and QLC will have a game-changing
impact across many different markets."

Samples of Toshiba's groundbreaking QLC device will begin shipping in
early September to SSD and SSD controller vendors for evaluation and
development purposes. Mass production is expected to begin in 2019.
Additionally, a packaged prototype will be showcased at the 2018
Flash Memory Summit
, taking place from August 6-9 in Santa Clara,
California. For more information, please visit

[1] Source: Toshiba Memory Corporation, as of July
19, 2018.
[2] Definition of capacity: Toshiba Memory Corporation
defines a gigabyte (GB) as 1,000,000,000 bytes. A computer operating
system, however, reports storage capacity using powers of 2 for the
definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and therefore shows
less storage capacity. Available storage capacity (including examples of
various media files) will vary based on file size, formatting, settings,
software and operating system, such as Microsoft Operating System and/or
pre-installed software applications, or media content. Actual formatted
capacity may vary.

About Toshiba Memory America, Inc.

Toshiba Memory America, Inc. (TMA) is the U.S.-based subsidiary of Toshiba
Memory Corporation
, a leading worldwide supplier of flash
and solid
state drives (SSDs)
. From the invention of flash memory to today's
breakthrough 96-layer BiCS FLASH™ 3D technology, Toshiba continues to
lead innovation and move the industry forward. For more information on
TMA, please visit
and follow the company on LinkedIn,
Twitter (@Toshiba_Memory)
and Facebook.

© 2018 Toshiba Memory America, Inc. All rights reserved. Information in
this press release, including product pricing and specifications,
content of services, and contact information is current and believed to
be accurate on the date of the announcement, but is subject to change
without prior notice. Technical and application information contained
here is subject to the most recent applicable Toshiba product

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