Market Overview

Third Party Logistics (3PL) Markets to 2022: Global Strategic Business Report 2018 - Applications in Set Top Boxes Boosts Demand for SiP Technology -


The "Third
Party Logistics (3PL) - Global Strategic Business Report"

report has been added to's

The report provides separate comprehensive analytics for the US, Canada,
Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual
estimates and forecasts are provided for the period 2015 through 2022.
Also, a six-year historic analysis is provided for these markets.

This report analyzes the worldwide markets for Third Party Logistics
(3PL) in US$ Million.

The global and US markets are also analyzed by the following

  • International Transportation Management
  • Domestic Transportation Management
  • Warehousing & Distribution
  • Others

The report profiles 380 companies including many key and niche
players such as:

  • Amkor Technology, Inc. (USA)
  • ASE Group (Taiwan)
  • ChipMOS Technologies Inc. (Taiwan)
  • Fujitsu Limited (Japan)
  • GS Nanotech (Russia)
  • Insight SiP (France)
  • Intel Corporation (USA)
  • Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
  • Kulicke & Soffa Pte Ltd. (Singapore)
  • Nanium S.A. (Portugal)
  • O.C.E. Technology Ltd. (Ireland)
  • Powertech Technologies, Inc. (Taiwan)
  • Renesas Electronics Corporation (Japan)
  • Samsung Electronics Co., Ltd. (South Korea)
  • ShunSin Technology (Zhongshan) Limited (China)
  • Si2 Microsystems Private Limited (India)
  • Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
  • STATS ChipPAC Ltd. (Singapore)
  • Unimicron Corporation (Taiwan)

Key Topics Covered

1. Industry Overview

2. Market Trends & Growth Drivers

  • Importance of SiP Technology in Electronics
  • Rising Demand for High Performance and Compact Consumer Electronics
    Drive Growth
  • List of Select SiP Solutions for Connected Devices
  • Growing Demand for Smart, Energy Efficient Electronics Provides
    Business Case for SiP
  • Growing Sales of Smartphones Bode Well for SiP Market
  • Growing Demand for Tablet PCs - A Key Growth Driver
  • Applications in Set Top Boxes Boosts Demand for SiP Technology
  • Computing Devices - A Key Growth Driver
  • IoT Opens New Growth Avenues for SiP
  • TSVs for Die-to-Die/Die-to-Package Substrate Communication
  • Advanced Nodes Demand Innovative Package Technologies
  • PCB Considerations Vital for Using SiP in IoT Systems
  • WLCSP for Compact Form Factors
  • Trend Towards Smart Homes Offers Growth Opportunities
  • Miniaturization of Electronics - A Major Growth Driver for SiP
  • Need for Compact and High Speed Performance Products Spurs Market
  • Shift in Direction towards More Than Moore's Law Benefits the SiP

3. Technology Overview

4. Recent Industry Activity

5. Focus on Select Global Players

6. Global Market Perspective

Total Companies Profiled: 51 (including Divisions/Subsidiaries

  • The United States (16)
  • Japan (3)
  • Europe (8)
    • France (4)
    • Rest of Europe (4)
  • Asia-Pacific (Excluding Japan) (25)
  • Middle East (1)

For more information about this report visit

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