Si2 Announces Sponsorship of "3-D Architectures for Semiconductor Integration and Packaging Conference"
Silicon Integration Initiative (Si2) announced today its sponsorship of the “3-D Architectures for Semiconductor Integration and Packaging Conference.” This conference will be held December 12-14, 2012, at the Sofitel San Francisco Bay, Redwood City, California, and is organized by RTI International.
“Si2's member companies recognize the growing business need for designing and integrating circuits in 3-D chip assemblies, as well as the technical challenges that must be solved to support them," says Sumit DasGupta, sr. vice-president of engineering at Si2. "Many of our member companies and other interested parties have also realized the growing importance of standards to enable interoperable design flows and have asked Si2 and other standards organizations to develop new standards in 3-D design flows. Our Open3D Technical Advisory Board is preparing several standards now for release to the industry.”
The 9th international conference, 3-D Architectures for Semiconductor Integration and Packaging, brings together technology and business leaders from around the world to take a look at the technology and market landscape for emerging 3-D device and systems integration and interconnect. Today, questions around 3-D solutions increasingly focus on when, not if, the industry will see product introduction and high volume manufacturing. Products based on 3-D chip scale packaging have already made significant inroads, in particular for image sensors, and 2.5-D devices with interposers, e.g. in FPGAs, are also seeing market introduction; very healthy market growth for such uses is widely anticipated.
The conference offers a unique opportunity to gain the latest technology and market insights on emerging and on-going 3-D integration and packaging efforts, as well as on technology and industry trends in this dynamic arena. Registration and additional information is available at: http://techventure.rti.org/index.html.
Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to-market, reduce costs, and meet the challenges of sub-micron design. Now in its 24th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents nearly 100 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org.
Silicon Integration Initiative
William Bayer, 512-342-2244, ext. 304