QuickLogic Signs Agreement with Second Top-Tier Foundry for ArcticPro(TM) eFPGA IP
SUNNYVALE, CA--(Marketwired - Feb 14, 2017) - QuickLogic Corporation (
"We believe there will be a strong need in the future for more heterogeneous computing and programmability at the edge of the network," said Brian Faith, president and CEO at QuickLogic Corporation. "QuickLogic's ArcticPro eFPGA foundry agreements enable this trend by providing semiconductor companies and OEMs the ability to add hardware programmability to SoC and ASIC designs."
The 40nm process is optimized for low power consumption, which is a common requirement for SoCs targeting the rapidly growing IoT market. By adding the flexibility enabled by QuickLogic's ultra-low-power ArcticPro eFPGA technology, new SoC designs can address broader markets, changing standards, incorporate new features and extend the life of the SoC design.
QuickLogic's FPGA technology and software development tools are proven solutions, time-tested over nearly three decades of shipping over 40 million FPGA devices to thousands of customers across multiple markets including consumer, industrial and military. Customers can initiate evaluation of this new ArcticPro eFPGA technology for their own applications starting this month for production tape-outs in Q3 of this year.
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About QuickLogic
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The QuickLogic logo and QuickLogic are registered trademarks and ArcticPro is a trademark of QuickLogic Corporation. All other brands or trademarks are the property of their respective holders and should be treated as such.
Code: QUIK-G
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