Kulicke & Soffa Launches AsterionTM EV – Enhanced Capability Hybrid Wedge Bonder

SINGAPORE--(BUSINESS WIRE)--

Kulicke & Soffa Industries, Inc. KLIC ("Kulicke & Soffa", "K&S" or the "Company"), announced today the launch of its new extended version of the Asterion^TM wedge bonder, Asterion^TM EV. The Asterion^TM EV is built on a new architecture with enhanced capability to address the industry's growing and changing applications needs. Its single platform can handle a multitude of interconnect materials such as large aluminum wire, PowerRibbon^TM and interconnects for battery cells.

Highlighted Features:

• Heightened productivity with a large bondable area (300mm x 800mm); improved MTBA with enhanced PR plus Geometric Model mode; and faster cycle time with direct drive motion system and advanced PR modes.
• Extended area that allows new applications such as adapting large battery packs or modules. Another advantage of the extended area is that it supports dual or even triple lane conveyancing material handling through the bonder which allow a single pass bonding.
• Configuration flexibility which support multi-device and multi-lane automated handler
• Improved performance due to a very stable platform for greater bond placement repeatability and consistent process results.
• Advanced capabilities with innovative software and hardware features such as ultrasonic normalization, host communications, bond process monitor, common data transfer and traceability functions; a Loop Former option that enables advanced square loop profiles; and advanced interconnect capability with an improved configurable bond head
• Ease of use with a new Bond Head Set-up Aid; an Intuitive Graphical User Interface (Windows 7 OS); a Graphical Editor for convenient program editing; Context Sensitive Help; and Easy Program Conversion from 3600/3700Plus to Asterion^TM EV

"The Asterion^TM EV solution is well accepted in new application fields such as interconnects for battery cells manufacturing. With the combination of the configurable bond head and enhanced algorithms on placement repeatability, the Asterion^TM EV has demonstrated stable process capability and performance. This is an exciting new launch for us and we anticipate a wide market adoption with the growth of battery cell interconnect technologies," said Chan Pin Chong, Kulicke & Soffa's Vice President of Wedge Bonder, Capillaries and Blades Business Line.

The Asterion^TM EV will debut at the SEMICON Taiwan show at Taipei Nangang Exhibition Centre, 4F, Booth Number 430, from September 7-9, 2016.

About Kulicke & Soffa

Kulicke & Soffa KLIC is a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, advanced SMT, wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (www.kns.com)

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