US Stock Futures Up Ahead Of Morgan Stanley Earnings
US stock futures traded higher in early pre-market trade, ahead of earnings from Morgan Stanley (NYSE: MS). Futures for the Dow Jones Industrial Average surged 25 points to 18,022.0, while the Standard & Poor's 500 index futures rose 2.70 points to 2,121.45. Futures for the Nasdaq 100 index gained 8.30 points to 4,658.30.
A Peek Into Global Markets
European markets were higher today, with the Spanish Ibex Index rising 0.85 percent, STOXX Europe 600 Index surging 0.50 percent and German DAX 30 index climbing 0.85 percent. French CAC 40 Index jumped 0.80 percent and London's FTSE 100 Index rose 0.21 percent.
In Asian markets, Hong Kong's Hang Seng Index fell 0.04 percent, China's Shanghai Composite Index rose 0.88 percent and India's BSE Sensex slipped 0.15 percent.
Analysts at Cowen upgraded Amazon.com, Inc. (NASDAQ: AMZN) from Market Perform to Outperform. The price target for Amazon.com has been raised from $435.00 to $565.00
Amazon.com shares gained 1.22 percent to $488.88 in pre-market trading.
- Cytox Ltd, an innovative developer of assays for risk assessment and prediction of dementia, and Affymetrix (NASDAQ: AFFX) announce a strategic partnership where the two companies are to collaborate on developing and commercializing a blood-based genetic assay for research in diagnosis and prognosis of Alzheimer's disease (AD) and Mild Cognitive Impairment (MCI). To read the full news, click here.
- SunEdison, Inc. (NASDAQ: SUNE) today announced that its wholly owned subsidiary, TerraForm Global, Inc. NASDAQGLBL, intends to commence an initial public offering of its Class A common stock on July 20, 2015. To read the full news, click here.
- xG Technology, Inc. (NASDAQ: XGTI) announced that its 1-for-10 reverse split of its common stock became effective at 5:00 p.m. Eastern Time on Friday, July 17, 2015, and the Common Stock will open for trading on July 20, 2015 on a post-split basis. To read the full news, click here.
- United Microelectronics Corporation (NYSE: UMC) today announced that it has entered volume production for the Through-Silicon-Via (TSV) technology used on the Advanced Micro Devices, Inc. (NYSE: AMD) Radeon R9 Fury X, the flagship GPU in the recently announced Radeon™ R 300 Series of graphics cards. To read the full news, click here.
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