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Teledyne DALSA To Showcase Vision Inspection Solutions At Pack Expo International


Teledyne DALSA (NYSE: TDY), a Teledyne Technologies company and global leader in machine vision technology, will feature the latest advancements for packaging and processing applications at Pack Expo International 2014, in South Hall Booth S-4147. Pack Expo International, the leading show dedicated to the latest advancements in packaging materials, containers, machinery, will be held in Chicago, on November 2-5, 2014.

Teledyne DALSA will showcase its smart cameras and multi-camera systems designed for verifying and validating product and packaging integrity. These include:

- BOA™ Smart Camera - a highly integrated vision system specifically designed for factory floor automation. Complete with the choice of embedded software, BOA offers robust 1D and 2D capabilities for part traceability as well trainable character and pattern recognition tools which customers can combine to satisfy a variety of identification and verification needs. Ideal for part recognition, tracking and verification, the BOA camera series offer a wide range of resolutions for both monochrome and color applications.

- GEVA™ 1000 - a high-performance multi-camera vision system that delivers low deployment cost with high performance processing. Integrated with high-speed camera ports, multi-core processing and a choice of application software, these systems offer a rich suite of identification tools as well as an extensive library of preprocessors and advanced algorithms for the toughest packaging applications.

Media Note:

For interview requests please email or visit Booth S-4147. For more information, visit the Vision Systems website. For high resolution images of Teledyne DALSA's products, please visit the online media kit.

About Teledyne DALSA, Inc.

Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized semiconductor products and services including MEMS. For more information, visit

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