Industry Sources Report Advanced Semiconductor Engineering to Team Up with Micron to Set Up Joint Packaging and Testing Fab in Xian, China -Digitimes

Micron

is currently producing standard DRAM chips from its Malaysia plant, but Plans to switch over to NAND flash production, according to

. The change will require Micron to outsource packaging capacity, including setting up a joint packaging and testing fab with Advanced Semiconductor Engineering

in Xian, China, according to sources. View full article http://www.digitimes.com/news/a20140318PD217.html