Aehr Test Systems Appoints Mark Allison as Vice President of Worldwide Sales

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Aehr Test Systems
AEHR
, a worldwide supplier of semiconductor test and burn-in equipment, today announced that Mark Allison has been appointed Vice President of Worldwide Sales. Mr. Allison will direct Aehr Test's worldwide sales organizations. Mr. Allison has over 25 years of experience in the semiconductor manufacturing and Automatic Test Equipment (ATE) industries. His last position was as Executive Vice President of Marketing at Verigy, a leader in the ATE business that was acquired by Advantest in 2011 for $1.1 billion. Prior to Verigy, Mr. Allison held various sales, marketing, general management and test engineering positions at companies including Advantest, Integrated Measurement Systems, Megatest, Micron and Texas Instruments. Mr. Allison received his BSEE from the University of Notre Dame. "We are pleased to have Mark join us. He brings Aehr Test strong experience in marketing and selling highly sophisticated test systems to semiconductor manufacturers," said Gayn Erickson, president and chief executive officer of Aehr Test Systems. "We are confident that his knowledge of the product applications and the customer base will help us to further expand the sales of our test and burn-in systems. As our customers are increasingly looking to Aehr Test for more cost-effective solutions to meet their test needs, we believe that this is an excellent time to bring on a person with Mark's expertise." About Aehr Test Systems Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic and memory integrated circuits and has an installed base of more than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, capacity needs and opportunities for Aehr Test products in package and wafer level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOXTM families of test and burn-in systems and the DiePak® carrier. The ABTS system is used in production and qualification testing of packaged parts for both low-power and high-power logic as well as all common types of memory devices. The FOX system is a full wafer contact test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die. For more information, please visit the Company's website at www.aehr.com.
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