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STMicroelectronics Signs Loan Agreement with European Investment Bank


PR N° C2710C STMicroelectronics Signs Loan Agreement with the European Investment Bank Euro 350 million multicurrency facility supports ST's R&D investments in Power, MEMS and Sensors, Microcontrollers, Advanced Analog and Healthcare high-growth applications  Euro 350 million floating-rate senior bonds repaid on March 17th with available resources   ST capital structure further strengthened  Geneva, March 26, 2013 - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has signed a new Euro 350 million loan agreement with the European Investment Bank (EIB). The facility, which has not yet been drawn by ST, is also available in the US$ equivalent amount and has an option for disbursement until September 2014 with final maturity eight years after disbursement. This new facility, which further strengthens the long-established relationship between ST and EIB, supports ST's activities in R&D and innovation related to the design and realization of the next generation of technologies and electronic devices for applications in Power, MEMS, Microcontrollers, Advanced Analog and Healthcare. This includes the full cycle from technology R&D and product development to application solutions that include software development and

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Posted-In: News Guidance Financing Contracts Management Global


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