CEVA-TeakLite-III DSP Receives DTS-HD Master Audio™ Logo Certification

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CEVA, Inc.
CEVA
, the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, announced today that its CEVA-TeakLite-III DSP core has been awarded DTS-HD Master Audio™ Logo certification. The certification, achieved using fully optimized SW implementations on an actual hardware platform of the CEVA-TeakLite-III DSP core, provides developers of high-end audio SoCs with a proven hardware and software solution that streamlines design cycle and substantially shortens time to market for DTS-HD compliant products. The native 32-bit CEVA-TeakLite-III DSP core, recently named the best overall audio processor by The Linley Group in its 2010 report on CPU and DSP cores, is the foundation for the CEVA-HD-Audio solution. The single-core solution is the most compact and power-efficient HD audio offering available for integration into home entertainment and consumer ICs, with lower overall cost and reduced die size compared to other audio solutions, some requiring dual processors for advanced audio use-cases. "We are pleased that CEVA has received DTS-HD Master Audio certification for their new line of audio processors. The CEVA-TeakLite-III DSP will allow users to fully experience DTS's high definition audio. As a result, customers can efficiently incorporate best in class DTS-certified sound quality in their products using this new high performance and cost effective audio engine," said Brian Towne, Executive Vice President and Chief Operating Officer at DTS.
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Posted In: NewsOfferingsbrian towneCEVAInformation Technologylinley groupSemiconductors
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