Market Overview

System in Package Market by Systems, Services and Mode of Delivery - Global Forecast to 2020

System in Package Market by Systems, Services and Mode of Delivery - Global Forecast to 2020

System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) – Global Trends & Forecasts to – 2014 – 2020

The ever-increasing demands for miniaturization and higher functionality at less cost processes have driven the development of stacked ICs and System in Package (SiP) technologies. System in Package (SiP) is a single reduced functional module realized by the horizontal tiling or vertical stacking of two or more similar or dissimilar bare die or packaged chips. Taking the chips nearer enables the highest level of silicon integration and area efficiency at the lowest cost, compared to mounting them separately in traditional ways. In doing so, the electrical pathway length between chips is reduced, leading to a higher performance.

System on Package (SOP) is an emerging trend in the system miniaturization technology in divergence to System-on-Chip (SOC) at IC level and System in Package (SiP) at module level. System in Package (SiP) is obtained by thinning ICs from its original 800 micron thick wafer dimensions to 50 microns and stacking as many as 10 of these, one on top of the other, in 3D form. These are then interconnected by either wire bond or flip-chip technology. The current Through Silicon via (TSV) developments have further condensed System in Package (SiP) by replacing flip chip with pad to pad bonding.

The capability to integrate different technologies and to reduce total production cost and time to market are the prime drivers for System in Package (SiP) packaging. System in Package (SiP) has enabled the rapid integration of active and passive devices into single package solutions. This approach has also reduced product costs, allowing systems to be partitioned into the most cost-effective blocks. The stacked System in Package (SiP) alignments reduce the system size and eliminate the cost of individual packages for each die. They also improve signal transmission times and reduced power by minimizing capacitive loads between ICs.

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The rapid expansion of the System in Package (SiP) market has inspired research and development in System in Package (SiP) associated technology by Integrated Device Manufacturers (IDM) as well as Electronic Manufacturing Services (EMS) providers and Semiconductor Assembly Services (SAS). With this evolution of System in Package(SiP) technology during the last few decades, the future trend for System in Package (SiP) technology in the next decade or two will be clearer if we look at the future electronics market sectors such as mobile products, high-end computers, automobiles, flat-panel High-Definition TVs (HDTVs), and sensors for security, health care, and environment. The consumer mobile products will advance to more multi functionality, thus, realizing the digital convergent dream with flexible displays with LED as a light source, thin film, or nano batteries.

Some of the key players in this market include Amkor Technology (U.S.), ASE Global (Taiwan), Powertech Technology (Taiwan), STATS ChipPAC (Singapore), ChipMOS Technologies (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), InsightSiP (France), Freescale Semiconductor Inc. (U.S.), Wi2Wi  Inc.(U.S.), and Nanium S.A. (Portugal), among others.

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List Of Figures

Figure 1 Markets Covered For Analysis
Figure 2 Research Methodology
Figure 3 Market Size Estimation
Figure 4 Data Triangulation Methodology
Figure 5 System In Package (Sip) Market Value, By Application, 2013 – 2020 ($Million)
Figure 6 Market Overview: System In Package (Sip)
Figure 7 History & Evolution Of System In Package (Sip)
Figure 8 System In Package (Sip) Industry Value Chain
Figure 9 Market: Impact Analysis OfMarket Drivers, 2013 – 2020
Figure 10 Market: Impact Analysis OfMarket Restraints, 2013 – 2020
Figure 11 Market: Impact Analysis OfThe Market Opportunities, 2013 – 2020
Figure 12 System In Package (Sip): Application Market
Figure 13 Market By Geography- Tree Structure
Figure 14 Amkor Technology Inc.: Company Snapshot
Figure 15 Amkor Technology Inc.: Product Portfolio
Figure 16 Amkor Technology : Swot Analysis
Figure 17 Ase Global Inc.: Company Snapshot
Figure 18 Ase Global Inc.: Product Portfolio
Figure 19 Ase Inc. : Swot Analysis
Figure 20 Chipmos Tech. Ltd: Company Snapshot
Figure 21 Chipmos Tech. Ltd: Products & Services
Figure 22 Chipbond Technology Corporation: Company Snapshot
Figure 23 Chipbond Technology Corporation: Product &Services
Figure 24 Fujitsu Ltd: Company Snapshot
Figure 25 Fujitsu Ltd: Product Portfolio
Figure 26 Gs Nanotech: Company Snapshot
Figure 27 Gs Nanotech: Services
Figure 28 Insight System in Package Inc.: Company Snapshot
Figure 29 Insight Sip Inc. Product Portfolio
Figure 30 Jiangsu Changjiang Electronics Technology Co. Ltd.: Company Snapshot
Figure 31 Jiangsu Changjiang Electronics Technology Co. Ltd.: Product Portfolio
Figure 32 Nanium : Company Snapshot
Figure 33 Nanium : Product Portfolio
Figure 34 Powertech Technology Inc.: Company Snapshot
Figure 35 Powertech Technology Inc. Product Portfolio
Figure 36 Qualcomm Incorporated : Company Snapshot
Figure 37 Qualcomm Incorporated : Product Classification
Figure 38 Qualcomm Incorporated : Swot Analysis
Figure 39 Siliconware Precision Industries Co., Ltd.: Company Snapshot
Figure 40 Siliconware Precision Industries Co., Ltd. : Product And Services
Figure 41 Ase Inc. : Swot Analysis
Figure 42 Stats Chippac Ltd. Company Snapshot
Figure 43 Stats Chippac Ltd.Product Portfolio
Figure 44 Toshiba Corporation: Company Snapshot
Figure 45 Toshiba Corporation: Product Portfolio
Figure 46 Toshiba Corporation : Swot Analysis
Figure 47 Wi2wi Corporation: Company Snapshot
Figure 48 Wi2wi Corporation. Product Portfolio

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