Kulicke & Soffa Industries Inc was incorporated in Pennsylvania in 1956. The Company designs, manufactures and sells capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits, high and low powered discrete devices, LEDs, and power modules. It also services, maintains, repairs and upgrades its equipment. The Company's customers primarily consist of semiconductor device manufacturers, their subcontract assembly suppliers, other electronics manufacturers and automotive electronics suppliers. It operates in two business segments, Equipment and Expendable Tools. It manufactures and sells a line of ball bonders, heavy wire wedge bonders and die bonders. Ball bonders are used to connect very fine wires, typically made of gold or copper, between the bond pads of the semiconductor device, or die, and the leads on its package. Wedge bonders use either aluminum wire or ribbon to perform the same function in packages that cannot use gold or copper wire because of either high electrical current requirements or other package reliability issues. Die bonders are used to attach a die to the substrate or lead frame which will house the semiconductor device. It manufactures and sells expendable tools for semiconductor packaging applications. The Company's Expendable Tools segment products include: Capillaries, Bonding wedges, and Saw blades. The Company's customers include IDM and subcontract assembly companies, industrial manufacturers and automotive electronics suppliers. It operates in a competitive environment. The Company is subject to various federal, state, local and foreign laws and regulations governing, among other things, the generation, storage, use, emission, discharge, transportation and disposal of hazardous materials and the health and safety of its employees.