Honeywell's Advanced Materials Help Mobile Devices Dissipate Heat To Perform Better

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Leading device manufacturers have integrated solutions from Honeywell Electronic Materials into tablets and smartphones

CHANDLER, Ariz., Sept. 25, 2014 /PRNewswire/ -- Honeywell HON Electronic Materials announced today that its advanced materials are being integrated into the production of tablets and smartphones, helping them stay cool and perform better.

Leading mobile electronics manufacturers are using Honeywell's thermal interface materials (TIMs) to dissipate the intense heat produced by increasingly powerful chips at the heart of these devices. If not managed properly, the heat can lead to performance issues and even cause the devices to stop performing altogether. 

"End users demand a lot from their devices and our materials help manufacturers manage heat that can threaten performance and longevity," said David Diggs, vice president and general manager of Honeywell Electronic Materials. "Our TIM product offerings, which are based on more than a half century of knowledge developing materials for the semiconductor industry, are helping device manufacturers meet the growing expectations as mobile devices continue to be central to everyday life."

Honeywell is a recognized leader in developing thermal management solutions that transfer and dissipate heat from advanced semiconductor devices. Honeywell's proven PTM and PCM series of thermal management materials are based on sophisticated phase-change chemistry and advanced filler technology that was developed specifically for high-performing electronic devices.

TIMs technology from Honeywell transfers thermal energy from the chip to the heat sink or spreader, where it is dissipated into the surrounding environment. This functionality keeps the chip cool while allowing the heat sink module to perform optimally.

Honeywell's unique, proprietary and patented formulations provide long-lasting chemical and mechanical stability, enabling consistently higher thermal performance compared with alternative thermal interface materials that break down or dry out.

This stability has been proven through the industry's most widely accepted accelerated aging tests including: extended baking at 150 degrees Celsius (more than 300 degrees Fahrenheit); thermal cycling from -55 to 125 degrees Celsius (-67 to 257 degrees Fahrenheit); and the Highly Accelerated Stress Test (HAST).  Honeywell's TIM offerings meet aggressive thermal needs such as thin bond line capability, low thermal impedance and long-term reliability.

Honeywell Electronic Materials, part of Honeywell Performance Materials and Technologies, supplies microelectronic polymers, electronic chemicals, and other advanced materials along with an extensive set of product offerings under its metals business segment, including physical vapor deposition (PVD) targets and coil sets, precious metal thermocouples, and low alpha emissivity plating anodes and advanced heat spreader materials used during back-end packaging processes for thermal management and electrical interconnect.

For more information, or to contact a Honeywell representative, visit www.honeywell-pmt.com/sm/em/.

Honeywell Performance Materials and Technologies (PMT) is a global leader in developing advanced materials, process technologies and automation solutions. PMT's Advanced Materials businesses manufacture a wide variety of high-performance products, including environmentally friendlier refrigerants and materials used to manufacture end products such as bullet-resistant armor, nylon, computer chips and pharmaceutical packaging. Process technologies developed by PMT's UOP business (www.uop.com) form the foundation for most of the world's refiners, efficiently producing gasoline, diesel, jet fuel, petrochemicals and renewable fuels. PMT's Process Solutions business (www.honeywellprocess.com) is a pioneer in automation control, instrumentation and services for the oil and gas, refining, pulp and paper, industrial power generation, chemicals and petrochemicals, biofuels, life sciences, and metals, minerals and mining industries.

Honeywell (www.honeywell.com) is a Fortune 100 diversified technology and manufacturing leader, serving customers worldwide with aerospace products and services; control technologies for buildings, homes, and industry; turbochargers; and  performance materials.  For more news and information on Honeywell, please visit www.honeywellnow.com.

This release contains certain statements that may be deemed "forward-looking statements" within the meaning of Section 21E of the Securities Exchange Act of 1934. All statements, other than statements of historical fact, that address activities, events or developments that we or our management intends, expects, projects, believes or anticipates will or may occur in the future are forward-looking statements. Such statements are based upon certain assumptions and assessments made by our management in light of their experience and their perception of historical trends, current economic and industry conditions, expected future developments and other factors they believe to be appropriate. The forward-looking statements included in this release are also subject to a number of material risks and uncertainties, including but not limited to economic, competitive, governmental, and technological factors affecting our operations, markets, products, services and prices. Such forward-looking statements are not guarantees of future performance, and actual results, developments and business decisions may differ from those envisaged by such forward-looking statements. We identify the principal risks and uncertainties that affect our performance in our Form 10-K and other filings with the Securities and Exchange Commission.

SOURCE Honeywell

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