XMOS Adopts SpringSoft's Latest Generation Laker Custom IC Design Solution to Cut Costs and Design Time
SpringSoft, Inc. (TAIEX: 2473), a global supplier of specialized IC design software, today announced that XMOS, developer of flexible multi-core microcontrollers for consumer and real-time applications, has adopted SpringSoft's latest generation OpenAccess (OA)-based Laker3™ custom IC platform for analog, mixed-signal, and custom digital design.
XMOS has developed the xCORE multicore microcontroller architecture for demanding embedded applications that require deterministic real-time performance. xCORE devices can be configured with a variety of software-based peripheral and I/O functions and are programmed within a familiar software development flow based on C. xCORE multicore microcontrollers are being used today by a rapidly expanding set of customers in consumer, audio, industrial and automotive applications.
XMOS development teams deployed the Laker3 Custom Layout System to integrate intellectual property (IP) components into a power management chip design. The intuitive methodology of the Laker3 platform, together with its broad foundry process design kit (PDK) support, enabled XMOS designers to implement it right away without extensive CAD customization or complicated PDK development. XMOS completed its first IP integration project within weeks of installing the tool.
“XMOS is a young, agile company, and the ease-of-use and simplicity of the Laker3 layout system was exactly what we needed to productively execute this project,” said Jon Ferguson, director of silicon at XMOS. “The Laker3 platform enables us to integrate GDSII IP blocks quickly and easily, and effectively use our knowledge of Laker tools and SpringSoft's excellent customer support to ensure design success.”
“XMOS' adoption of Laker3 is testament to the value our next-generation platform delivers in solving the very real design and IP integration challenges that chip developers face today. It also demonstrates the dedication of our global organization to providing a best-in-class user experience, so our customers can focus their efforts on creating innovative custom designs,” commented Dave Reed, senior director of marketing for custom IC design solutions at SpringSoft.
The third generation of SpringSoft's popular Laker™ custom IC design product family provides a complete front-to-back environment with design entry, custom layout, custom digital place and route, and analog prototyping tools. Its OA-based software platform is optimized for performance and interoperability in multi-vendor design flows with interoperable process design kits (iPDK) and third-party tool integrations. More than 300 companies, including many of the world's leading semiconductor companies, have adopted Laker solutions for designs down to 20nm. For more information about Laker products, visit: http://www.springsoft.com/products.
SpringSoft, Inc. (TAIEX: 2473) is a global supplier of innovative automation technologies for the design and verification of complex digital, analog and mixed-signal SoCs. Its award-winning product portfolio is used by more than 400 of today's leading semiconductor companies, foundries, and electronic systems OEMs. Headquartered in Hsinchu, Taiwan, SpringSoft is the largest company in Asia specializing in IC design software and a recognized industry leader in customer service with multiple R&D sites and local support offices around the world. For more information, visit www.springsoft.com.
Laker3 and Laker are trademarks of SpringSoft, Inc. All other trademarks or registered trademarks are the property of their respective owners.
Stacey Hsieh, + 886-3-5794567 x686
For SpringSoft USA
Laurie Stanley, + 1-978-834-6560
For SpringSoft Europe
Annette Bley, +44 (20) 7482 4800
For SpringSoft Japan
Sumiko Miida, + 81-45-624-8834