Radisys and EZchip Announce Partnership to Solve Mobile Operators' Service Scalability Challenges

Radisys® Corporation

, the services acceleration company, and EZchip Semiconductor Ltd.

a leader in high-performance processing solutions for carrier and data center networks, today announced the integration path towards EZchip's next-generation NPS network processor with Radisys' FlowEngine™ intelligent traffic distribution solutions for Communications Service Providers (CSPs). The telco-centric, carrier-grade solution provides CSPs with a service-aware integrated solution of hardware, software and professional services, enabling CSPs to guarantee services and roll-out new services in an SDN environment – at the scale required for millions of subscribers around the world. This Smart News Release features multimedia. View the full release here: http://www.businesswire.com/news/home/20150910005455/en/ As network traffic continues to explode, CSPs require a scalable solution that can support millions of subscribers and flows. SDN allows for the separation of the control plane and data plane, supporting CSPs scalability requirements, while reducing ongoing OpEx and CapEx costs. However, these CSPs require a pre-integrated solution combining hardware, software and professional services support so they can focus resources on service deployment, not system integration. The integrated solution from Radisys and EZchip enables key functional capabilities to deliver this scalability in a small, but powerful footprint. "We are pleased to partner with Radisys to solve CSPs scalability challenges for SDN as Radisys has developed a truly innovative solution with its FlowEngine technology, delivering the intelligent traffic distribution CSPs require as they disaggregate the control plane from the data plane in an SDN deployment," said Eli Fruchter, CEO, EZchip. "Our next-gen NPS network processor is unmatched in performance and flexibility, and Radisys' expertise as a leading provider of software and hardware solutions combined with its professional services arm allows us to support CSPs real-world, carrier-grade SDN deployments, delivering on key use cases such as Service Function Chaining." "Today, CSPs are laying their foundations for their SDN deployments for years to come and our forward-looking approach by partnering with EZchip to integrate its NPS processor with our software and hardware sets the new standard for SDN deployments," said Brian Bronson, CEO, Radisys. "EZchip is the leader in NPU technology and its NPS network processor allows for maximum performance for data plane processing in a compact, modular form factor such as our TDE system. Together we can solve CSPs' scalability challenges as they deploy SDN with our strong foundation." Integrated Solution Includes Three Cornerstones for "Service Delivery" in an SDN Environment Radisys and EZchip's integrated solution delivers guaranteed support to millions of subscribers and flows with complete flexibility, statefulness and service assurance. Service Availability: The solution provides needed scalability to support millions of subscribers and flows; subscribers can count on service being available – when and where they need it. Service Visibility: The solution provides network analytics, giving CSPs visibility into their network to identify and drive services, enforce intelligent policies and guarantee Service Level Agreements. The ability to guarantee service requires guaranteed state. Together, Radisys and EZchip deliver stateful awareness of flow classification in one compact, integrated system with less processing and minimized latency compared to alternate solutions. Service Flexibility: The solution delivers unmatched flexibility. Its feature-rich software libraries, open source SDN interfaces, Layer 2-7 processing and professional services to deliver customization as needed allow CSPs the flexibility to rapidly introduce new services and generate new revenue. Radisys' and EZchip's integrated solution is available today from Radisys. Contact sales@radisys.com for pricing details.