SunEdison Semi Reports Initiation of Manufacturing Consolidation

SunEdison Semiconductor Limited

("SunEdison Semiconductor" or the "Company"), a leading supplier of semiconductor wafers to the global semiconductor device industry, today announced that it has initiated a plan to consolidate its manufacturing footprint to better match demands of the industry. The consolidation will consist of closing its Ipoh, Malaysia wafering plant by the end of 2016, and relocating the associated capacity to other plant sites. The Company does not expect its total capacity to change. This closure is consistent with the Company's strategy to continuously drive operational efficiencies, improve quality, lower costs, and maximize utilization across its global manufacturing footprint. By late 2016, with the closure of the Ipoh plant, the Company's global footprint will be consolidated from eight to seven plants. The Company does not expect its total capacity to change. The Ipoh plant produces 200mm semiconductor wafers. SunEdison Semiconductor will work closely with customers to complete the qualifications required and/or build adequate supply to support their needs. During the transition, we expect to continue to deliver superior products and service without disruption to our customers. Employees affected by the closure are being offered customary severance and benefits packages. Further details will be included in our Form 8-K filed with the SEC and discussed during the Company's second quarter 2015 results conference call on August 6, 2015.