Bruker Launches ContourSP 3D Optical Microscope

Bruker Corporation

today announced that it has launched the ContourSP large panel metrology system, which more than doubles the measurement throughput of the high-density interconnect (HDI) substrates in multi-chip modules (MCM) over previous generation SP models used by the semiconductor packaging industry. Specifically designed to measure each layer of the printed circuit board (PCB) panels during manufacturing, the gage-capable ContourSP assures the minimum recipe development time, highest yield, maximum up-time, and lowest cost per measured panel in production. These features have already led to over $5 million in orders by several leading HDI/MCM PCB manufacturers. Bruker's ContourSP 3D Optical Microscope for the Printed Circuit Board Industry (Photo: Business Wire)