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Dow Electronic Materials, a business unit of The Dow Chemical Company
DOW, today announced two key commercial-ready technologies for
leading-edge semiconductor and printed circuit board (PCB) manufacturing. The
company also unveiled new advances in its extreme ultraviolet (EUV)
lithography development efforts:
* Dow introduces the first two polishing pad families under its new IKONIC™
chemical mechanical planarization (CMP) pad platform.
* Dow brings to market two new MICROFILL™ copper plating products that
enhance the performance of high density interconnect (HDI) and IC
substrate PCBs.
* Dow unveils critical performance advances for its EUV photoresists and
ancillary lithography materials.
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