Dow's Electronic Materials Extends Leadership in Advanced Semi, Printed Circuit Board Technologies
Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE: DOW), today announced two key commercial-ready technologies for leading-edge semiconductor and printed circuit board (PCB) manufacturing. The company also unveiled new advances in its extreme ultraviolet (EUV) lithography development efforts:
* Dow introduces the first two polishing pad families under its new IKONIC™ chemical mechanical planarization (CMP) pad platform. * Dow brings to market two new MICROFILL™ copper plating products that enhance the performance of high density interconnect (HDI) and IC substrate PCBs. * Dow unveils critical performance advances for its EUV photoresists and ancillary lithography materials.
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