Ultratech Acquires Patents from IBM for Semiconductor Bumping and Packaging

Ultratech

today announced that it has acquired the rights to a collection of patents from IBM - these include fundamental patents in packaging such as C4 bumping, Ball Grid Arrays, lead-free solders and 3D packaging. Representing both U.S. and foreign patents, the portfolio includes claims directed at methods of making, at compositions and at structures of semiconductor devices. This acquisition strengthens and broadens Ultratech's offerings to facilitate advanced packaging at the lower device nodes.