FSI International Receives Orders for its ANTARES® Systems from Several Leading Device Manufacturers

FSI International, Inc.

announced today that several leading device producers, including a new fab, have placed orders for ANTARES® CryoKinetic Cleaning Systems. Chip providers currently use the system for various back-end-of-line (“BEOL”) particle removal processes and front-end-of-line (“FEOL”) advanced node applications as they continue their quest to improve yields. The systems are expected to ship in fiscal 2012. The ANTARES® System is a fully automated, single-wafer, CryoKinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. CryoKinetic processing technology is an all-dry, chemical free process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films. The system's highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES® System for its defect reduction and yield improvement benefits at current leading edge technology nodes.