Invensas Acquires ALLVIA 3D-IC Packaging Technology

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that it has acquired the patent assets of ALLVIA, Inc. In addition, Invensas has entered into a two-year collaborative partnership with ALLVIA to further develop technology and intellectual property in the 3-dimensional integrated circuit (3D-IC) packaging space.