In a report published Thursday, JP Morgan analyst Rod Hall commented on recent reports that Intel Corporation INTC will provide wireless modem chips Apple Inc.'s AAPL next generation smartphone in 2016.
The 7360 chip will ship inside a special version of the iPhone that will be marketed to Ems in Asia and Latin America, VentureBeat previously reported. The publication added that Intel's 7360 LTE modem chip is reportedly capable of 450mbps of download speed, and supports Category 9/10 LTE and 3X carrier aggregation.
"We believe that Apple spent more than $3.9 billion on iPhone baseband chips in fiscal 2014 with its incumbent chip vendor," Hall wrote. "We note that our own supply chain discussions suggest that the next iPhone could have two baseband suppliers – one of whom would be Intel."
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Hall also added that the development would have a "negative impact" on Apple's incumbent chip vendor.
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